Netac Basic DDR4
Original chips improve the performance of computer
Original chips improve the performance of computer
Selected original chips, strict inspection process, 8-layer PCB board, stable performance
Excellent compatibility
Memory products have passed the motherboard compatibility test of mainstream brands on the market, ensure the stability of the system for along time
Gold-plated craft gold finger
Gold plating process, stronger conductivity and corrosion resistance
| Memory voltage | 1.35 V |
|---|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Lead plating | Gold |
| SPD profile | Yes |
| Memory channels | Single-channel |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Operating temperature (T-T) | 0 – 85 °C |
| Storage temperature (T-T) | -55 – 100 °C |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Width | 133.3 mm |
| Height | 31.2 mm |
Netac Basic DDR4-3200 8G C16
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation and calibration
- On-board I2C serial presence-detect (SPD) EEPROM
- Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Databus write cyclic redundancy check (CRC)
- Temperature controlled refresh (TCR)
- Command/Address (CA) parity
- Per DRAM Addressability is supported
- 8 bit pre-fetch
- Fly-by topology
- Command/Address latency (CAL)
- Terminated control command and address bus
- PCB: Height 1.23” (31.25mm)
- Gold edge contacts
- RoHS Compliant and Halogen-Fre
1000 in stock
364.21$
Free shipping from $50
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